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254. HOW TO HACK ANDROID Mobile Phones or Download Modules and Patches for Sythogy Ivory II Grand Piano. It has complete touch,.1. Field of the Invention
The present invention relates to a semiconductor device and a production method thereof, and more particularly to a semiconductor device and a production method thereof in which the wire breakage of a wire bonding or a bump connection is inhibited.
2. Description of the Related Art
Recently, an LSI having more circuits or a semiconductor chip having more terminals has been produced to satisfy the requirement for a higher integration density and miniaturization.
Therefore, a wire bonding has been used for connection of the terminals to electrodes by using wires such as aluminum wires.
However, in the wiring and the connection of the wiring, the electrode of a semiconductor device to which the wire is connected is usually formed in the above-described LSI.
For example, a large number of bumps are generally formed in the semiconductor device. However, since the wiring of the electrode has been formed in a narrow portion of the semiconductor device, the area of the wiring region has been reduced.
Therefore, the wire of the electrode is often broken when bonding to the terminal.
In addition, for example, the following is generally used as a method of reducing the breakage of the wire of the electrode.
(1) A wire of a metal film is formed, for example, by coating a metal salt onto the electrode, and the metal film is baked by using an acid or a volatile solvent, thereby forming a metal oxide film thereon. Then, the metal oxide film is reacted by the electrolyte of the acid and the vapor of the solvent, and a metal fine layer made of a metal such as aluminum is deposited onto the metal oxide film. Then, the residual portion of the solvent is removed, and the metal fine layer is flattened. Then, the metal fine layer is baked, and the electrode is connected to the wire by a bonder.
(2) A metal fine layer is formed by using a dry etching method such as a physical method and an electrochemical method.
(3) A metal fine layer is formed by using a sputtering method or a CVD method.
(4) An electron beam melting method is used for connection of the wire to the metal fine layer.
However, even if these methods are used, the wire breakage of the electrode is often generated.
For example,
https://colab.research.google.com/drive/1AgXm64tnPRKfEWIuwz3nl7g6lQz8uHID
https://colab.research.google.com/drive/1yMpz-alGnK4OaRsvlVduZT3dc90oh31d
https://colab.research.google.com/drive/1Tn0VpIgEDjxqeV9QuOFhs0vjF3k3SHLK
https://colab.research.google.com/drive/1qUCPewc-xa3cWU0vvjXg9iyq4hdEHKT5
https://colab.research.google.com/drive/1wa7Fl9lL8DnxRM0dpn5vfCQs_SCo2FP5
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